Tuan Anh Vo

USPTO Granted Patents = 20 (Patent Applications = 3)

Average Co-Inventor Count = 3.9

ph-index = 7

Forward Citations = 298(Granted Patents)

Location History:

Hopewell Junction, NY (US) (2012 - 2016)
Albany, NY (US) (2014 - 2017)

Company Filing History:

17 out of 164,108

International Business Machines Corporation

Canon Anelva Corporation

patents

where one patent can have more than one assignee

Years Active: 2012-2017

where 'Filed Patents' based on already Granted Patents

20 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9620481 - Substrate bonding with diffusion barrier structures (2017-04-11),

2. 9564386 - Semiconductor package with structures for cooling fluid retention (2017-02-07),

3. 9502288 - Method of forming an interconnect structure (2016-11-22),

4. 9472457 - Manganese oxide hard mask for etching dielectric materials (2016-10-18),

5. 9412629 - Wafer bonding for 3D device packaging fabrication (2016-08-09),

6. 9263366 - Liquid cooling of semiconductor chips utilizing small scale structures (2016-02-16),

7. 9142488 - Manganese oxide hard mask for etching dielectric materials (2015-09-22),

8. 9087876 - Titanium oxynitride hard mask for lithographic patterning (2015-07-21),

9. 9064937 - Substrate bonding with diffusion barrier structures (2015-06-23),

10. 9058974 - Distorting donor wafer to corresponding distortion of host wafer (2015-06-16),

11. 9054109 - Corrosion/etching protection in integration circuit fabrications (2015-06-09),

12. 9053926 - Cyclical physical vapor deposition of dielectric layers (2015-06-09),

13. 9028628 - Wafer-to-wafer oxide fusion bonding (2015-05-12),

14. 8987133 - Titanium oxynitride hard mask for lithographic patterning (2015-03-24),

15. 8986921 - Lithographic material stack including a metal-compound hard mask (2015-03-24),

Title: Tuan Anh Vo: Transforming the Future through Innovation

Introduction: Tuan Anh Vo, a visionary inventor based in Albany, NY, is a relentless pioneer in the world of inventions. His passion for technological advancements and creating a better future drives his innovative spirit.

Latest Patents: Tuan Anh Vo's recent patents showcase his groundbreaking work in the field of technology. One of his latest inventions involves "Substrate bonding with diffusion barrier structures," where he introduces a metallic dopant element to enhance oxygen-affinity in copper-based metal pads. Another patent, "Semiconductor package with structures for cooling fluid retention," demonstrates his expertise in designing semiconductor assemblies for efficient liquid and gas cooling processes.

Career Highlights: With an impressive portfolio of 20 patents, Tuan Anh Vo has made significant contributions to the tech industry. He has worked with renowned companies such as IBM (International Business Machines Corporation) and Globalfoundries Inc., where his innovative ideas have paved the way for cutting-edge technologies.

Collaborations: Throughout his career, Tuan Anh Vo has collaborated with talented individuals like Wei Lin and Spyridon Skordas. These partnerships have led to the development of groundbreaking inventions and have further solidified his reputation as a visionary inventor.

Conclusion: Tuan Anh Vo's dedication to innovation and his commitment to creating a better future through technology make him a true pioneer in the world of inventions. His relentless pursuit of excellence continues to inspire future generations of inventors, shaping the world of technology for years to come.

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3 patents pending:

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