The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Mar. 15, 2012
Son Van Nguyen, Yorktown Heights, NY (US);
Alfred Grill, Yorktown Heights, NY (US);
Thomas J. Haigh, Jr., Albany, NY (US);
Hosadurga Shobha, Albany, NY (US);
Tuan A. Vo, Hopewell Junction, NY (US);
Son Van Nguyen, Yorktown Heights, NY (US);
Alfred Grill, Yorktown Heights, NY (US);
Thomas J. Haigh, Jr., Albany, NY (US);
Hosadurga Shobha, Albany, NY (US);
Tuan A. Vo, Hopewell Junction, NY (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
An interconnect structure is provided that has improved electromigration resistance as well as methods of forming such an interconnect structure. The interconnect structure includes a composite M-MOx cap located at least on the upper surface of the Cu-containing material within the at least one opening. The composite M-MOx cap includes an upper region that is composed of the metal having a higher affinity for oxygen than copper and copper oxide and a lower region that is composed of a non-stoichiometric oxide of said metal.