The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Nov. 12, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Wei Lin, Albany, NY (US);

Son V. Nguyen, Schenectady, NY (US);

Spyridon Skordas, Albany, NY (US);

Tuan A. Vo, Albany, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/473 (2006.01); H01L 23/467 (2006.01); H01L 23/04 (2006.01); H01L 21/48 (2006.01); H01L 23/06 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/481 (2013.01); H01L 21/4803 (2013.01); H01L 21/4817 (2013.01); H01L 21/4871 (2013.01); H01L 23/04 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 23/3675 (2013.01); H01L 23/467 (2013.01); H01L 25/0655 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds.


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