The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Mar. 18, 2013
International Business Machines Corporation, Armonk, NY (US);
Canon Anelva Corporation, Kanagawa, JP;
Paul Jamison, Hopewell Junction, NY (US);
Juntao Li, Guilderland, NY (US);
Vamsi Paruchuri, Clifton Park, NY (US);
Tuan A. Vo, Albany, NY (US);
Takaaki Tsunoda, Albany, NY (US);
Sanjay Shinde, San Ramon, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Canon Anelva Corporation, Kanagawa, JP;
Abstract
Embodiments include methods of forming dielectric layers. According to an exemplary embodiment, a dielectric layer may be formed by determining a desired thickness of the dielectric layer, forming a first dielectric sub-layer having a thickness less than the desired thickness by depositing a first metal layer above a substrate and oxidizing the first metal layer, and forming n (where n is greater than 1) additional dielectric sub-layers having a thickness less than the desired thickness above the first dielectric sub-layer by the same method of the first dielectric sub-layer so that a combined thickness of all dielectric sub-layers is approximately equal to the desired thickness.