The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Aug. 11, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Wei Lin, Albany, NY (US);

Spyridon Skordas, Wappingers Falls, NY (US);

Tuan A. Vo, Albany, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/485 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01); H01L 21/02 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/0228 (2013.01); H01L 21/02175 (2013.01); H01L 21/02244 (2013.01); H01L 21/02266 (2013.01); H01L 21/02271 (2013.01); H01L 21/02282 (2013.01); H01L 21/3081 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 21/76804 (2013.01); H01L 21/76829 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/485 (2013.01); H01L 23/5222 (2013.01); H01L 23/5226 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24331 (2015.01);
Abstract

A manganese oxide layer is deposited as a hard mask layer on substrate including at least a dielectric material layer. An optional silicon oxide layer may be formed over the manganese oxide layer. A patterned photoresist layer can be employed to etch the optional silicon oxide layer and the manganese oxide layer. An anisotropic etch process is employed to etch the dielectric material layer within the substrate. The dielectric material layer can include silicon oxide and/or silicon nitride, and the manganese oxide layer can be employed as an effective etch mask that minimizes hard mask erosion and widening of the etched trench. The manganese oxide layer may be employed as an etch mask for a substrate bonding process.


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