The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jun. 03, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); B32B 38/18 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02035 (2013.01); B32B 38/1825 (2013.01); Y10T 156/17 (2015.01); B32B 38/0012 (2013.01); B32B 2457/14 (2013.01);
Abstract
Improving wafer-to-wafer bonding alignment. Determining planar distortions of the bonding surface of a host wafer. Mounting a donor wafer on a bonding chuck by a plurality of fixation points, the bonding chuck including multiple zones capable of movement relative to each other. Distorting the bonding surface of the donor wafer by moving the zones of the bonding chuck relative to each other to cause distortions of the bonding surface of the donor wafer such that the distortions of the donor wafer bonding surface correspond to the determined planar distortions of the host wafer bonding surface.