The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
May. 19, 2015
Globalfoundries Inc., Grand Cayman, KY;
Daniel C. Edelstein, White Plains, NY (US);
Douglas C. La Tulipe, Jr., Guilderland, NY (US);
Wei Lin, Albany, NY (US);
Deepika Priyadarshini, Guilderland, NY (US);
Spyridon Skordas, Wappingers Falls, NY (US);
Tuan A. Vo, Albany, NY (US);
Kevin R. Winstel, East Greenbush, NY (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
A metallic dopant element having a greater oxygen-affinity than copper is introduced into, and/or over, surface portions of copper-based metal pads and/or surfaces of a dielectric material layer embedding the copper-based metal pads in each of two substrates to be subsequently bonded. A dopant-metal silicate layer may be formed at the interface between the two substrates to contact portions of metal pads not in contact with a surface of another metal pad, thereby functioning as an oxygen barrier layer, and optionally as an adhesion material layer. A dopant metal rich portion may be formed in peripheral portions of the metal pads in contact with the dopant-metal silicate layer. A dopant-metal oxide portion may be formed in peripheral portions of the metal pads that are not in contact with a dopant-metal silicate layer.