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For the Inventor, By the Inventor

Kanagawa, Japan

Tsuneaki Kamei

USPTO Granted Patents = 17

Average Co-Inventor Count = 5.0

ph-index = 11

Forward Citations = 543(Granted Patents)


Location History:

  • Mitaka, JA (1976 - 1977)
  • Tokyo, JP (1979)
  • Kanagawa, JP (1982 - 1990)
  • Kanagawa-ken, JP (1999)
  • Naka-gun, JP (1999)

Company Filing History:

goldMedal17 out of 42,508 
 
Hitachi, Ltd.
 patents
silverMedal1 out of 256 
 
Anelva Corporation
 patents
where one patent can have more than one assignee

Years Active: 1976-1999

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17 patents (USPTO):Explore Patents
1. 5942185 - Lead-free solder used for connecting electronic parts on organic (1999-08-24),
2. 5867809 - Electric appliance, printed circuit board, remained life estimation (1999-02-02),
3. 4963239 - Sputtering process and an apparatus for carrying out the same (1990-10-16),
4. 4806725 - Circuit substrate and thermal printing head using the same (1989-02-21),
5. 4724060 - Sputtering apparatus with film forming directivity (1988-02-09),
6. 4610774 - Target for sputtering (1986-09-09),
7. 4610770 - Method and apparatus for sputtering (1986-09-09),
8. 4517444 - Thermal printhead (1985-05-14),
9. 4460494 - Resistor (1984-07-17),
10. 4444635 - Film forming method (1984-04-24),
11. 4405435 - Apparatus for performing continuous treatment in vacuum (1983-09-20),
12. 4401539 - Sputtering cathode structure for sputtering apparatuses, method of (1983-08-30),
13. 4343986 - Thermal printhead (1982-08-10),
14. 4161431 - Process for producing thin film resistor (1979-07-17),
15. 4042726 - Selective oxidation method (1977-08-16),

Title: Tsuneaki Kamei: Innovator in Lead-Free Solder Technology

Introduction

Tsuneaki Kamei is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of electronics, particularly in the development of lead-free solder technologies. With a total of 17 patents to his name, Kamei's work has had a lasting impact on the industry.

Latest Patents

One of Kamei's latest patents involves a lead-free solder used for connecting electronic parts on organic substrates. This innovative solder can withstand soldering temperatures of 220 to 230 degrees Celsius while maintaining mechanical strength at high temperatures of up to 150 degrees Celsius. The solder composition includes 3-5% Zinc and 10-23% Bismuth, with the balance being Tin. This composition allows for soldering on conventional organic substrates at reflow temperatures similar to those of traditional lead-tin eutectic solders. Additionally, Kamei has developed an electric appliance with a remaining life estimation system that utilizes an integrated circuit with sensors to monitor environmental conditions affecting the lifespan of reusable components.

Career Highlights

Throughout his career, Tsuneaki Kamei has worked with notable companies such as Hitachi, Ltd. and Anelva Corporation. His experience in these organizations has contributed to his expertise in electronic materials and technologies.

Collaborations

Kamei has collaborated with esteemed colleagues, including Katsuo Abe and Shigeru Kobayashi. Their joint efforts have further advanced the field of electronics and contributed to the development of innovative solutions.

Conclusion

Tsuneaki Kamei's contributions to lead-free solder technology and electronic appliances demonstrate his commitment to innovation and environmental sustainability. His work continues to influence the electronics industry, paving the way for future advancements.

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