Tomoya Oohiraki

Title: Innovations of Tomoya Oohiraki

Introduction

Tomoya Oohiraki is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of circuit substrate technology, holding a total of 16 patents. His work focuses on methods for manufacturing advanced insulation circuit substrates, which are crucial for modern electronic devices.

Latest Patents

Oohiraki's latest patents include a "Method of manufacturing bonded body for insulation circuit substrate board" and "bonded body for insulation circuit substrate board." These innovations involve forming aluminum circuit layers on a ceramic substrate and subsequently creating copper circuit layers through a unique lamination process. The method ensures that the copper boards are bonded to the aluminum layers via solid phase diffusion, enhancing the performance and reliability of the circuit substrates. Another notable patent is the "Method for producing insulating circuit substrate with heat sink," which details a process for integrating a heat sink with an insulating circuit substrate, improving thermal management in electronic applications.

Career Highlights

Tomoya Oohiraki is currently employed at Mitsubishi Materials Corporation, where he continues to develop innovative solutions in circuit substrate technology. His expertise and dedication have positioned him as a key figure in his field, contributing to advancements that benefit various industries.

Collaborations

Oohiraki has collaborated with notable colleagues, including Sotaro Oi and Takeshi Kitahara. Their combined efforts have led to the development of cutting-edge technologies that push the boundaries of circuit substrate manufacturing.

Conclusion

Tomoya Oohiraki's contributions to the field of circuit substrate technology are significant and impactful. His innovative patents and collaborations reflect his commitment to advancing electronic manufacturing processes.