The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Oct. 09, 2015
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 21/48 (2006.01); B23K 20/02 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01); H05K 3/20 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4882 (2013.01); B23K 20/02 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/473 (2013.01); H05K 1/0203 (2013.01); H05K 3/20 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Preventing a deformation when a metal layer made of copper or copper alloy is brazed on an aluminum-made cooler, a power-module substrate with cooler having low thermal resistance and high bonding reliability is provided: a circuit layer made of copper or copper alloy is bonded on one surface of a ceramic board and a metal layer made of copper or copper alloy is bonded on the other surface of the ceramic board; a second metal layer made of aluminum or aluminum alloy is bonded to the metal layer by solid-phase diffusion; and a cooler made of aluminum alloy is brazed on the second metal layer with Al-based Mg-included brazing material.