The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Oct. 08, 2014
Mitsubishi Materials Corporation, Tokyo, JP;
Tomoya Oohiraki, Kitamoto, JP;
Sotaro Oi, Kitamoto, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A maximum length of a heat sink is set as 'L' and a warp amount of the heat sink is set as 'Z'; the warp amount “Z” is set as a positive value if a bonded surface of the heat sink to a metal layer is deformed to be concave or the warp amount “Z” is set as a negative value if the bonded surface is deformed to be convex; a ratio Z/L of the maximum length “L” and the warp amount “Z” measured at 25° C. is in a range not smaller than −0.005 and not larger than 0.005, and the ratio Z/L is in the range not smaller than −0.005 and not larger than 0.005 even when it is heated to 280° C. and then cooled to 25° C.