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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10607915 B1

PDFFull Text
Date of Patent:
Mar. 31, 2020

Filed:

Jun. 30, 2015

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Tomoya Oohiraki, Kitamoto, JP;

Sotaro Oi, Kitamoto, JP;

Kimihito Nishikawa, Sunto-gun, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Sonya M Sengupta

Int. Cl.
CPC ...
H01L 23/373 (2006.01); C04B 37/02 (2006.01); B32B 7/12 (2006.01); C04B 35/645 (2006.01); B32B 9/04 (2006.01); B32B 9/00 (2006.01); B32B 15/00 (2006.01); B32B 15/20 (2006.01); B32B 15/04 (2006.01); B32B 7/04 (2019.01); B32B 7/05 (2019.01); H01L 23/492 (2006.01); H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B32B 7/04 (2013.01); B32B 7/05 (2019.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 15/00 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C04B 35/645 (2013.01); C04B 37/028 (2013.01); H01L 23/4924 (2013.01); B32B 2250/44 (2013.01); B32B 2307/20 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); C04B 2235/449 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01); C04B 2237/706 (2013.01); C04B 2237/86 (2013.01); H01L 21/4882 (2013.01); H01L 23/12 (2013.01); H01L 23/36 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01);
Abstract

A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.

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