Mitsubishi Materials Corporation

Tomoya Oohiraki

Sotaro Oi

Takeshi Kitahara

Yoshiyuki Nagatomo

Ryohei Yumoto

Kimihito Nishikawa

Hiromasa Hayashi

Ryouhei Yumoto

Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.

Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board

A method is provided for producing an insulating circuit substrate with a heat sink including an insulating circuit substrate and a heat sink, the insulating circuit substrate including a circuit layer and a metal layer that are formed on an insulating layer, and the heat sink being bonded to the metal layer side. The method includes: an aluminum bonding layer forming step of forming an aluminum bonding layer formed of aluminum or an aluminum alloy having a solidus temperature of 650&#xb0; C. or lower on the metal layer; and a heat sink bonding step of laminating a copper bonding material formed of copper or a copper alloy between the aluminum bonding layer and the heat sink and bonding the aluminum bonding layer, the copper bonding material, and the heat sink to each other by solid phase diffusion bonding.

Method for producing insulating circuit substrate with heat sink

To provide a method of manufacturing power module substrate board at high productivity and a ceramic-copper bonded body in which warps are reduced. In a bonded body-forming step, a circuit layer-forming copper layer consisting of a plurality of first copper layers is formed by arranging and bonding a plurality of first copper boards on a first surface of a ceramic board, and a metal layer-forming copper layer consisting of a second copper layer with a smaller arrangement number than that of the first copper layers is formed by bonding a second copper board having a larger planar area than that of the first copper board and a smaller thickness than that of the first copper board so as to cover at least two of adjacent substrate board-forming areas on a second surface of the ceramic board among the substrate board-forming areas partitioned by the dividing groove.

Method of manufacturing power module substrate board and ceramic-copper bonded body

A manufacturing method of an electronic-component-mounted module includes a step of forming a laminate of: a ceramic substrate board, a circuit layer made of aluminum or aluminum alloy on the ceramic substrate board, a first silver paste layer between the circuit layer and one surface of an electronic component, the electronic component, a lead frame made of copper or copper alloy, and a second silver paste layer between the other surface of the electronic component and the lead frame; and a step of batch-bonding bonding the circuit layer, the electronic component, and the lead frame at one time by heating the laminate to a heating temperature of not less than 180&#xb0; C. to 350&#xb0; C. inclusive with adding a pressure of 1 MPa to 20 MPa inclusive in a laminating direction on the laminate, to sinter the first and second silver paste layers and form first and second silver-sintered bonding layers.

Manufacturing method of electronic-component-mounted module

A heat sink-attached power module substrate board has a ratio (A1&#xd7;t1&#xd7;&#x3c3;1&#xd7;&#x3b1;1)/{(A2&#xd7;t2&#xd7;&#x3c3;2&#xd7;&#x3b1;2)+(A3&#xd7;t3&#xd7;&#x3c3;3&#xd7;&#x3b1;3)} at 25&#xb0; C. is not less than 0.70 and not more than 1.30, where A1 (mm) is a bonding area of a second layer and a first layer composing a circuit layer; t1 (mm) is an equivalent board thickness, &#x3c3;1 (N/mm) is yield strength, and &#x3b1;1 (/K) is a linear expansion coefficient, all of the second layer, where A2 (mm) is a bonding area of the heat radiation-side bonding material and the metal layer; t2 (mm) is equivalent board thickness, &#x3c3;2 (N/mm) is yield strength, and &#x3b1;2 (/K) is a linear expansion coefficient, all of the heat radiation-side bonding material, and where A3 (mm) is a bonding area of the heat sink and the heat radiation-side bonding material; t3 (mm) is equivalent board thickness, &#x3c3;3 (N/mm) is yield strength, and &#x3b1;3 (/K) is a linear expansion coefficient, all of the heat sink.

Heat sink-attached power module substrate board and power module

An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.

Insulation circuit board with heat sink

An electronic-component-mounted module has an electronic component, a first silver-sintered bonding layer bonded on one surface of the electronic component, a circuit layer made of copper or copper alloy and bonded on the first silver-sintered bonding layer, and a ceramic substrate board bonded on the circuit layer, and further has an insulation circuit substrate board with smaller linear expansion coefficient than the electronic component, a second silver-sintered bonding layer bonded on the other surface of the electronic component, and a lead frame with smaller linear expansion coefficient than the electronic component bonded on the second silver-sintered bonding layer; and a difference in the linear expansion coefficient between the insulation circuit substrate board and the lead frame is not more than 5 ppm/&#xb0; C.

Electronic-component-mounted module design to reduce linear expansion coefficient mismatches

Provided with an insulation circuit board in which a circuit layer is joined to one side of a ceramic substrate and a metal layer made of aluminum or aluminum alloy is joined to the other side of the ceramic substrate, and a heat sink joined to the metal layer; the heat sink has a first metal layer made of copper joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of copper or copper alloy joined to an opposite side of the ceramic board material to the first metal layer; and a thickness T1 of the first metal layer is 0.3 mm to 3.0 mm inclusive and equal to or more than a thickness T2 of the second metal layer.

A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

Provided is a heat-sink-attached power-module substrate, in which a metal layer and first layers are formed from aluminum sheets having a purity of 99.99 mass % or greater and a heat sink and second layers are formed from aluminum sheets having a purity lower than that of the metal layer and the first layers: when a thickness is t1 (mm), a joined-surface area is A1 (mm2), yield strength at 25&#xb0; C. is &#x3c3;11 (N/mm2), yield strength at 200&#xb0; C. is &#x3c3;12 (N/mm2) in the second layers; a thickness is t2 (mm), a joined-surface area is A2 (mm2), yield strength at 25&#xb0; C. is &#x3c3;21 (N/mm2), and yield strength at 200&#xb0; C. is &#x3c3;22 (N/mm2) in the heat sink.

Heat-sink-attached power-module substrate and power module

Preventing a deformation when a metal layer made of copper or copper alloy is brazed on an aluminum-made cooler, a power-module substrate with cooler having low thermal resistance and high bonding reliability is provided: a circuit layer made of copper or copper alloy is bonded on one surface of a ceramic board and a metal layer made of copper or copper alloy is bonded on the other surface of the ceramic board; a second metal layer made of aluminum or aluminum alloy is bonded to the metal layer by solid-phase diffusion; and a cooler made of aluminum alloy is brazed on the second metal layer with Al-based Mg-included brazing material.

Power-module substrate with cooler and method of producing the same

A power-module substrate unit having at least one power-module substrate including one ceramic substrate, a circuit layer formed on one surface of the ceramic substrate, and a metal layer formed on another surface of the ceramic substrate, and a heat sink on which the metal layer of the power-module substrate is bonded, in which the metal layer is made of an aluminum plate having purity of 99.99 mass % or higher; the heat sink is made of an aluminum plate having purity of 99.90 mass % or lower; and the circuit layer has a stacking structure of a first layer made of an aluminum plate having the purity of 99.99 mass % or higher and being bonded to the ceramic substrate and a second layer made of the aluminum plate having the purity lower than 99.90 mass % and being bonded on a surface of the first layer.

Power-module substrate unit and power module

A maximum length of a heat sink is set as 'L' and a warp amount of the heat sink is set as 'Z'; the warp amount &#x201c;Z&#x201d; is set as a positive value if a bonded surface of the heat sink to a metal layer is deformed to be concave or the warp amount &#x201c;Z&#x201d; is set as a negative value if the bonded surface is deformed to be convex; a ratio Z/L of the maximum length &#x201c;L&#x201d; and the warp amount &#x201c;Z&#x201d; measured at 25&#xb0; C. is in a range not smaller than &#x2212;0.005 and not larger than 0.005, and the ratio Z/L is in the range not smaller than &#x2212;0.005 and not larger than 0.005 even when it is heated to 280&#xb0; C. and then cooled to 25&#xb0; C.

Method of manufacturing power-module substrate with heat-sink

In a power-module substrate unit, a circuit layer is structured by a plurality of small circuit layers; a ceramic substrate layer is structured by at least one plate; the small circuit layers are formed to have a layered structure having a first aluminum layer bonded on one surface of the ceramic substrate layer and a first copper layer bonded on the first aluminum layer by solid diffusion; a radiation plate is made of copper or copper alloy; the metal layer and the radiation plate are bonded by solid diffusion.

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Saitama, Japan

Tomoya Oohiraki