Tigard, OR, United States of America

Ting Zhong


Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 107(Granted Patents)


Company Filing History:


Years Active: 2006-2019

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13 patents (USPTO):

Title: Ting Zhong - Innovator in Electrical Interconnection Technologies

Introduction

Ting Zhong is a notable inventor based in Tigard, OR (US), recognized for his contributions to electrical interconnection technologies. With a total of 13 patents to his name, he has made significant advancements in the field, particularly while working at Intel Corporation.

Latest Patents

Among his latest patents, Ting Zhong has developed innovative solutions such as "Solder contacts for socket assemblies." This patent focuses on techniques and configurations that enhance electrical connections in socket assemblies. One embodiment involves placing a solder contact on the bottom surface of a die package, ensuring a conductive coupling with the electrical contacts of the die package. The design allows for improved electrical conduction by using solder that is sufficiently soft, and the pins of the socket assembly are configured to penetrate the solder contact for better connectivity.

Another significant patent is "Interconnect alloy material and methods," which showcases a solder and methods for forming electrical interconnections. This includes gallium-based solders that incorporate particles of other solders mixed with a gallium-based matrix. The methods described include innovative techniques for applying solder, such as swiping a solder material over a surface with a resist pattern and using an acid solution to aid in solder adhesion.

Career Highlights

Ting Zhong's career at Intel Corporation has been marked by his dedication to advancing electrical interconnection technologies. His work has not only contributed to the company's innovation but has also set new standards in the industry.

Collaborations

Throughout his career, Ting has collaborated with talented individuals such as Fay Hua and Aleksandar Aleksov, further enhancing the innovative environment at Intel Corporation.

Conclusion

Ting Zhong's contributions to electrical interconnection technologies through his patents and work at Intel Corporation highlight his role as a leading inventor in the field. His innovative approaches continue to influence advancements in electrical engineering.

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