The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Jun. 30, 2011
Rajashree Baskaran, Seattle, WA (US);
Kimin Jun, Hillsboro, OR (US);
Ting Zhong, Tigard, OR (US);
Roy E. Swart, Hillsboro, OR (US);
Paul B. Fischer, Portland, OR (US);
Rajashree Baskaran, Seattle, WA (US);
Kimin Jun, Hillsboro, OR (US);
Ting Zhong, Tigard, OR (US);
Roy E. Swart, Hillsboro, OR (US);
Paul B. Fischer, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.