The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Jun. 01, 2005
Applicants:
Jianxing LI, Albuquerque, NM (US);
Ming Fang, Portland, OR (US);
Ting Zhong, Tigard, OR (US);
Fay Hua, San Jose, CA (US);
Kevin J. Lee, Beaverton, OR (US);
Inventors:
Jianxing Li, Albuquerque, NM (US);
Ming Fang, Portland, OR (US);
Ting Zhong, Tigard, OR (US);
Fay Hua, San Jose, CA (US);
Kevin J. Lee, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A structure including a substrate, a copper bump formed over the substrate, and a barrier layer comprising an alloy of at least one of iron and nickel, formed over the copper bump, and methods to make such a structure.