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Fay Hua

This inventor holds 47 USPTO granted patents and 5 published patent applications and 2 EPO patents, primarily in Electronic Packaging. Top assignees: Intel Corporation, Other. Active years: 2003-2022.

USPTO Granted Patents = 47 (Patent Applications = 5)

% Patents Active = 48.9

EPO Patents = 2 (Patent Applications = 1)

Average Co-Inventor Count = 2.4

ph-index = 12

Forward Citations = 532(Granted Patents)

Location History:

Freemont, CA (US) (2008)
San Jose, CA (US) (2003 - 2010)
Fremont, CA (US) (2008 - 2022)

Company Filing History:

46 out of 56,184

Intel Corporation

patents

1 out of 834,307

Other

patents

Years Active: 2003-2022

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Areas of Expertise:

Solder Compositions

Thermal Interface Materials

Die Stacking Techniques

Electromigration Barrier

Heat Spreader

Electronic Assemblies

Nano-Sized Metals

Low Temperature Solder

Capillary Underflow

Reactive Solder Material

Interconnect Shunt

Composite Solder TIM

47 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11282633 - Device with out-plane inductors (2022-03-22),

2. 11222863 - Techniques for die stacking and associated configurations (2022-01-11),

3. 10777538 - System on package architecture including structures on die back side (2020-09-15),

4. 10734236 - Electronic devices with components formed by late binding using self-assembled monolayers (2020-08-04),

5. 10697065 - Sam assisted selective e-less plating on packaging materials (2020-06-30),

6. 10595410 - Non-planar on-package via capacitor (2020-03-17),

7. 10321573 - Solder contacts for socket assemblies (2019-06-11),

8. 10304804 - System on package architecture including structures on die back side (2019-05-28),

9. 10304686 - Electronic devices with components formed by late binding using self-assembled monolayers (2019-05-28),

10. 9860988 - Solder contacts for socket assemblies (2018-01-02),

11. 9824962 - Local dense patch for board assembly utilizing laser structuring metallization process (2017-11-21),

12. 9406582 - Apparatus to minimize thermal impedance using copper on die backside (2016-08-02),

13. 8441118 - Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages (2013-05-14),

14. 8242602 - Composite solder TIM for electronic package (2012-08-14),

15. 7960831 - Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same (2011-06-14),

Title: Fay Hua: A Pioneer in Innovation

Introduction:

In the realm of technology and innovation, Fay Hua stands out as a true pioneer with a relentless pursuit of creating a better future through his inventive spirit. Based in Fremont, CA, Fay's dedication to pushing the boundaries of technology has led to a remarkable impact on the industry.

Latest Patents:

Fay Hua, with an impressive portfolio of 47 patents, continues to drive innovation with his latest inventions:

1. Device with out-plane inductors: An apparatus featuring a planar dielectric surface, conductive leads, traces, and innovative wire configurations.

2. Techniques for die stacking and associated configurations: Describing techniques for fabricating stacked integrated circuit (IC) devices, optimizing wafer sorting, and die thinning processes.

Career Highlights:

Having made significant contributions to technology, Fay Hua has been associated with renowned companies like Intel Corporation. His expertise and innovative mindset have paved the way for groundbreaking inventions that have redefined the technological landscape.

Collaborations:

Throughout his career, Fay has collaborated with esteemed professionals such as Carl L. Deppisch and Thomas John Fitzgerald. These partnerships have not only enhanced his inventions but have also fostered a culture of innovation and knowledge-sharing.

Conclusion:

Fay Hua's impact on the world of inventions is truly remarkable, inspiring generations of inventors to push boundaries and strive for excellence. His legacy as a pioneer in innovation will continue to shape the future of technology and pave the way for transformative advancements in the industry.

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