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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10304804 B1

PDFFull Text
Date of Patent:
May. 28, 2019

Filed:

Mar. 31, 2017

System on package architecture including structures on die back side

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Fay Hua, Fremont, CA (US);

Telesphor Kamgaing, Chandler, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorneys:

Konrad Raynes Davda & Victor LLP

Alan S. Raynes

Primary Examiner:

Cheung Lee

Assistant Examiner:

Stephen C Smith

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 21/02 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/022 (2013.01); H01L 23/293 (2013.01); H01L 23/3192 (2013.01); H01L 23/481 (2013.01); H01L 23/64 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 23/66 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02315 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01);
Abstract

Embodiments include devices and methods, including a device including a substrate comprising a semiconductor, the substrate including a front side comprising active elements and a backside opposite the front side. The device includes a dielectric layer on the backside, and a passive component on the dielectric layer on the backside. In certain embodiments, the passive device is formed on a self-assembled monolayer (SAM). Other embodiments are described and claimed.

Find Patent Forward Citations

Hua, Fay. (2019). System on package architecture including structures on die back side (U.S. Patent No. 10304804). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10304804

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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