The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Mar. 31, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Fay Hua, Fremont, CA (US);
Telesphor Kamgaing, Chandler, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 21/02 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/022 (2013.01); H01L 23/293 (2013.01); H01L 23/3192 (2013.01); H01L 23/481 (2013.01); H01L 23/64 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 23/66 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02315 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01);
Abstract
Embodiments include devices and methods, including a device including a substrate comprising a semiconductor, the substrate including a front side comprising active elements and a backside opposite the front side. The device includes a dielectric layer on the backside, and a passive component on the dielectric layer on the backside. In certain embodiments, the passive device is formed on a self-assembled monolayer (SAM). Other embodiments are described and claimed.