The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Sep. 29, 2016
Intel Corporation, Santa Clara, CA (US);
Fay Hua, Fremont, CA (US);
Adel A. Elsherbini, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods of forming microelectronic package structures are described. Those methods/structures may include forming a high density region on a board comprising a first plurality of conductive structures disposed on a dielectric material on the board, wherein the first plurality of conductive structures comprises a first pitch between individual ones of the first plurality of conductive structures. A low density region on the board comprises a second plurality of conductive structures disposed on the dielectric material, wherein the second plurality of conductive structures comprises a second pitch between individual ones of the second plurality of conductive structures, wherein the second pitch is more than about twice the magnitude of the first pitch.