Company Filing History:
Years Active: 2008
Title: **Innovator Spotlight: Jianxing Li**
Introduction
Jianxing Li is a prominent inventor based in Albuquerque, NM, whose contributions to the field of technology have led to two noteworthy patents. His work primarily revolves around enhancing semiconductor manufacturing processes through innovative structures and methods.
Latest Patents
Jianxing Li holds two significant patents that reflect his expertise and innovative approach. The first, titled “Capping Copper Bumps,” describes a structure that includes a substrate and a copper bump formed over it, complemented by a barrier layer made from an alloy of iron and nickel. This invention outlines methods to fabricate a reliable structure, enhancing the integrity of semiconductor components.
His second patent, “Dense Intermetallic Compound Layer,” details an apparatus and methods for creating a bump limiting metallization structure. This invention employs a two-step bump reflow process designed to reduce intermetallic compound porosity while also increasing the strength of the bumps, improving die yield and overall device reliability. The first phase of this method involves annealing a bump limiting metallurgy and a solder plug below the liquidus temperature, which forms a dense intermetallic compound layer. The second phase requires heating above the liquidus temperature to achieve the final solder bump.
Career Highlights
Jianxing Li is currently employed at Intel Corporation, where he significantly contributes to the development of advanced semiconductor technologies. His role at one of the leading technology companies allows him to leverage his expertise in materials science and engineering, driving innovation forward.
Collaborations
Throughout his career, Jianxing has collaborated with distinguished coworkers, including Ming Fang and Ting Zhong. These partnerships have fostered a creative environment, facilitating the exchange of ideas and contributing to successful innovations in the semiconductor field.
Conclusion
Jianxing Li's inventive contributions and patents exemplify his dedication to advancing technology in the semiconductor industry. His work not only enhances current technological capabilities at Intel Corporation but also lays a foundation for future innovations in the field. As he continues to collaborate and innovate, Jianxing Li remains a key figure in shaping the future of semiconductor manufacturing.