The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Aug. 24, 2004
Christopher August Debelius, Rio Rancho, NM (US);
Jianxing LI, Albuquerque, NM (US);
Christopher August Debelius, Rio Rancho, NM (US);
Jianxing Li, Albuquerque, NM (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve die yield, and device reliability. The first step comprises annealing a bump limiting metallurgy and a solder plug at a temperature below the liquidus temperature of the solder plug to form a dense intermetallic compound layer between the solder plug and the bump limiting metallurgy. The second step comprises heating the bump limiting metallurgy and the solder plug at a temperature above the liquidus temperature of the solder plug to form a solder bump.