The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Aug. 14, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Ting Zhong, Tigard, OR (US);
Rajashree Raji Baskaran, Portland, OR (US);
Aleksandar Aleksov, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); B23K 35/02 (2006.01); B23K 35/24 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); B23K 1/0016 (2013.01); B23K 1/206 (2013.01); B23K 3/0623 (2013.01); B23K 3/08 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/24 (2013.01); B23K 35/26 (2013.01); B23K 35/302 (2013.01); B23K 35/3033 (2013.01); B23K 2201/42 (2013.01);
Abstract
A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.