The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2008

Filed:

Mar. 11, 2005
Applicants:

Ting Zhong, Tigard, OR (US);

Valery Dubin, Portland, OR (US);

Ming Fang, Portland, OR (US);

Inventors:

Ting Zhong, Tigard, OR (US);

Valery Dubin, Portland, OR (US);

Ming Fang, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a barrier layer on a substrate, wherein the barrier layer comprises molybdenum; and forming a lead free interconnect structure on the barrier layer.


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Zhong, Ting. (2008). Forming a barrier layer in interconnect joints and structures formed thereby (U.S. Patent No. 7416980). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7416980

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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