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For the Inventor, By the Inventor

Rochester, MN, United States of America

Theron Lee Lewis

This inventor holds 38 USPTO granted patents and 13 published patent applications, primarily in Circuit Board Technology. Top assignee: International Business Machines Corporation. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Theron Lee Lewis. Retrieved from https://idiyas.com/inventor/theron-lee-lewis

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 

% Patents Active = 60.5

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 47(Granted Patents)


Company Filing History:

goldMedal38 out of 166,351 
 
International Business Machines Corporation
 patents

Years Active: 2007-2026

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Areas of Expertise:
Circuit Board
Press-Fit Connectors
Electromagnetic Shielding
Thermal Management
Shape-Memory Alloys
3D Metrology
Component Assembly
Reliability Enhancement
Nondestructive Testing
Dye and Pry Process
Land-Grid-Array
Thermal Interface Material
38 patents (USPTO):Explore Patents
1. 12744357 - Controlled extraction of electronic connector from electronic connector board (2026-09-22),
2. 12696399 - Reworking solder component without part removal (2026-07-28),
3. 12677396 - Heatsink with phase changing plugs and extinguishing coolant (2026-07-07),
4. 12676439 - Cantilever contact support using memory metal structure (2026-07-07),
5. 12256494 - Modified internal clearance(s) at connector pin aperture(s) of a circuit board (2025-03-18),
6. 12253354 - Radio frequency identification based three-dimensional metrology (2025-03-18),
7. 12100910 - Shape-memory alloy lock for connectors (2024-09-24),
8. 11906574 - Hybrid socket warp indicator (2024-02-20),
9. 11784424 - Reliability enhancement of press fit connectors (2023-10-10),
10. 11742602 - Press-fit rework method (2023-08-29),
11. 11733154 - Thermal interface material detection through compression (2023-08-22),
12. 11699884 - Electromagnetic shielding of heatsinks with spring press-fit pins (2023-07-11),
13. 11647591 - Compliant pin surface mount technology pad for rework (2023-05-09),
14. 11641717 - Soldering of end chip components in series (2023-05-02),
15. 11555793 - Anti-vibration fixturing system for nondestructive testing (2023-01-17),

Title: The Innovative Journey of Theron Lee Lewis

Introduction: Theron Lee Lewis, a talented inventor hailing from Rochester, MN, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Theron Lee Lewis holds several patents in various technological domains, showcasing his versatility and ingenuity in inventing new solutions to complex problems.

Career Highlights: Throughout his illustrious career, Theron Lee Lewis has been recognized for his exceptional problem-solving skills and his ability to think outside the box. His inventions have revolutionized industries and improved the lives of many.

Collaborations: Theron Lee Lewis has collaborated with leading tech companies and research institutions to bring his inventions to life. His collaborative spirit and innovative mindset have led to the development of cutting-edge technologies.

Conclusion: Theron Lee Lewis stands as a beacon of innovation in the field of technology, inspiring others to push the boundaries of what is possible. His dedication to creating impactful inventions cements his legacy as a pioneering inventor in Rochester, MN.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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