The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Jul. 07, 2021
International Business Machines Corporation, Armonk, NY (US);
Stephen Michael Hugo, Stewartville, MN (US);
Theron Lee Lewis, Rochester, MN (US);
Timothy Jennings, Rochester, MN (US);
Timothy P. Younger, Rochester, MN (US);
David J. Braun, St. Charles, MN (US);
Jennifer I. Bennett, Rochester, MN (US);
John R. Dangler, Rochester, MN (US);
James D. Bielick, Pine Island, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.