Saint Charles, MN, United States of America

David J Braun

This inventor holds 34 USPTO granted patents and 8 published patent applications, primarily in Electronic Connector Technology. Top assignees: International Business Machines Corporation, Other. Active years: 1995-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David J Braun. Retrieved from https://idiyas.com/inventor/david-j-braun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 

% Patents Active = 61.8

Average Co-Inventor Count = 4.3

ph-index = 2

Forward Citations = 43(Granted Patents)


Location History:

  • Newtown, PA (US) (2012 - 2015)
  • Hopewell, NJ (US) (2018)
  • St Charles, MN (US) (2021)
  • St. Charles, MN (US) (1995 - 2024)

Company Filing History:

goldMedal29 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal4 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1995-2026

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Areas of Expertise:
Electronic Connector
Soldering Techniques
Thermal Interface Materials
Press-Fit Rework
Shape-Memory Alloy
Localized Rework
Electromagnetic Shielding
Circuit Board Assembly
Nondestructive Testing
Flexible Rework Device
Heat Sinks
Surface Mount Technology
34 patents (USPTO):Explore Patents

Title: Innovations and Contributions of David J Braun

Introduction: David J Braun, a distinguished inventor based in St. Charles, MN, has made remarkable contributions to the field of electrical engineering, particularly in connector technologies. With an impressive portfolio of 27 patents, his innovations exhibit a keen understanding of complex engineering challenges and solutions.

Latest Patents: Among his latest contributions are the "Shape-memory alloy lock for connectors" and the "Hybrid socket warp indicator." The first patent involves an electrical connector designed with a unique shape-memory alloy that interacts with an inner wafer, enhancing the reliability of connections. The second patent introduces a hybrid socket dynamic warp indicator that assists in measuring warpage conditions in printed circuit board assemblies. This innovative solution provides crucial insights into the integrity and performance of socket connectors following thermal events.

Career Highlights: David J Braun is currently affiliated with International Business Machines Corporation (IBM), where he has been instrumental in steering innovative projects that push the boundaries of electrical connectivity and circuit design. His extensive experience and expertise have positioned him as a valuable asset in the field.

Collaborations: Throughout his career, David has worked alongside esteemed colleagues, including John Richard Dangler and Theron Lee Lewis. Collaborating with these professionals has enabled the development of cutting-edge solutions that have a lasting impact on technology and engineering practices.

Conclusion: David J Braun's work exemplifies the spirit of innovation in engineering. His patents not only reflect his ingenious approach to problem-solving but also contribute significantly to the advancement of connector technologies. His dedication and collaborative efforts continue to inspire future innovations in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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