The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Jul. 27, 2020
International Business Machines Corporation, Armonk, NY (US);
David J. Braun, St. Charles, MN (US);
John R. Dangler, Rochester, MN (US);
Timothy P. Younger, Rochester, MN (US);
James D. Bielick, Pine Island, MN (US);
Stephen Michael Hugo, Stewartville, MN (US);
Theron Lee Lewis, Rochester, MN (US);
Jennifer I. Bennett, Rochester, MN (US);
Timothy Jennings, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.