The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Oct. 19, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Theron Lee Lewis, Rochester, MN (US);

Timothy P. Younger, Rochester, MN (US);

David J. Braun, St. Charles, MN (US);

John R. Dangler, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/3447 (2026.01); H05K 3/3452 (2026.01); H05K 3/3485 (2026.01); H05K 3/3494 (2026.01); H05K 1/184 (2026.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); H05K 3/3447 (2013.01); H05K 3/3452 (2013.01); H05K 3/3485 (2020.08); H05K 1/184 (2013.01);
Abstract

A method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. The method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.


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