The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Aug. 30, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John R. Dangler, Rochester, MN (US);

Theron Lee Lewis, Rochester, MN (US);

David J. Braun, St. Charles, MN (US);

Eric Nguyen Phan, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H05K 3/34 (2006.01); B23K 37/04 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/34 (2013.01); B23K 1/0016 (2013.01); B23K 37/04 (2013.01); B23K 2101/42 (2018.08);
Abstract

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.


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