Eric Nguyen Phan

Title: Innovations of Eric Nguyen Phan

Introduction

Eric Nguyen Phan is an accomplished inventor based in Rochester, MN (US). He has made significant contributions to the field of printed circuit board design and interconnect systems for power applications. With a total of two patents to his name, Phan's work showcases his expertise and innovative thinking.

Latest Patents

Phan's latest patents include "Soldering of end chip components in series" and "Dual level contact design for an interconnect system in power applications." The first patent outlines a method for reworking printed circuit boards by utilizing two chip components in series. This method involves selecting and placing the components on a support structure, followed by a detailed soldering process to ensure proper connections. The second patent presents an interconnect system designed for power applications, featuring a receptacle with multiple conductive walls and sacrificial contact areas. This design enhances the reliability and efficiency of power connections.

Career Highlights

Eric Nguyen Phan is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to apply his inventive skills in a collaborative environment, contributing to the company's reputation for technological advancement.

Collaborations

Phan has worked alongside notable colleagues such as John Richard Dangler and Theron Lee Lewis. These collaborations have fostered a creative atmosphere that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Eric Nguyen Phan is a notable inventor whose contributions to printed circuit board design and interconnect systems have made a significant impact in the field. His innovative patents and collaborative efforts at IBM highlight his dedication to advancing technology.