Santa Clara, CA, United States of America

Tao Feng

This inventor holds 34 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignees: Alpha Omega Semiconductor Inc., Cadence Design Systems, Inc., Texas Instruments Corporation. Active years: 2008-2016.

USPTO Granted Patents = 34 

% Patents Active = 85.3

Average Co-Inventor Count = 2.4

ph-index = 8

Forward Citations = 226(Granted Patents)


Company Filing History:


Years Active: 2008-2016

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Areas of Expertise:
Semiconductor
Chip Scale Package
Power MOSFET
Wafer-Level Packaging
Ultra-Thin Wafer
Composite Power Device
Inductor
High-Voltage Device
Substrateless Packaging
Electroless Plating
Stacked Inductor
Edge Support Ring
34 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Tao Feng

Introduction

Tao Feng, an accomplished inventor based in Santa Clara, California, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 34 patents, Feng continues to push the boundaries of innovation, notably in the design and functionality of vertical semiconductor devices.

Latest Patents

One of Tao Feng's latest innovations is the patent for a vertical semiconductor MOSFET device with double substrate-side multiple electrode connections. This advanced semiconductor device is designed with a substrate-side exposed device-side electrode (SEDE). Key features include a semiconductor substrate that incorporates device-side electrodes, along with a through substrate trench (TST) that intricately connects the SEDE. The design enables efficient operation while also providing mechanisms for interconnection via conductive connectors. Additionally, the patent details the use of substrate-side electrodes and passivation techniques that enhance device packaging. Another noteworthy invention is the substrate-less power semiconductor device, which presents a novel approach to constructing power devices by utilizing vertical conductive power semiconductor device wafers and innovative molding and grinding techniques that reduce the overall thickness during production.

Career Highlights

Throughout his career, Tao Feng has worked with prominent companies, including Alpha & Omega Semiconductor Corporation and Texas Instruments Corporation. His experiences in these organizations have allowed him to leverage his expertise in semiconductor design and contribute to groundbreaking innovations in power semiconductor technology.

Collaborations

Feng has collaborated with renowned experts in the field, such as François Hébert and Yueh-Se Ho. These partnerships have strengthened his work and ultimately led to the development of advanced technologies that address modern challenges in semiconductor applications.

Conclusion

Tao Feng's dedication to innovation and his impressive array of patents underscore his influence in the semiconductor industry. With an unwavering commitment to enhancing device performance and efficiency, Feng continues to be a pivotal figure in the realm of electrical engineering and semiconductor technology. His contributions not only showcase his expertise but also serve as a foundation for future advancements in the field.

Profile summary based on public USPTO records.
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