The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Dec. 21, 2007
Ming Sun, Sunnyvale, CA (US);
Tao Feng, Santa Clara, CA (US);
François Hébert, San Mateo, CA (US);
Yueh-se Ho, Sunnyvale, CA (US);
Ming Sun, Sunnyvale, CA (US);
Tao Feng, Santa Clara, CA (US);
François Hébert, San Mateo, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Alpha & Omega Semiconductor, Inc., Sunnyvale, CA (US);
Abstract
A method for making back-to-front electrical connections in a wafer level chip scale packaging process is disclosed. A wafer containing a plurality of semiconductor chips is mounted on a package substrate. Each semiconductor chip in the plurality includes one or more electrodes on an exposed back side. Scribe lines between two or more adjacent chips on the wafer are removed to form relatively wide gaps. A conductive material is applied to the back side of the semiconductor chips and in the gaps. The conductive material in the gaps between two or more of the chips is then cut through leaving conductive material on the back side and on side walls of the two or more chips. As a result, the conductive material provides an electrical connection from the electrode on the back side of the chip to the front side of the chip.