Tokyo, Japan

Takashi Hayasaka

This inventor holds 20 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Technology. Top assignees: Mitsubishi Denki Kabushiki Kaisha, Hitachi Metals, Ltd., Renesas Technology Corp.. Active years: 1996-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Hayasaka. Retrieved from https://idiyas.com/inventor/takashi-hayasaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 90.0

 

Average Co-Inventor Count = 4.8

ph-index = 7

Forward Citations = 123(Granted Patents)


Location History:

  • Hyogo, JP (1996 - 2004)
  • Tsurumi, JP (2007 - 2008)
  • Minato, JP (2011)
  • Kitaibaraki, JP (2021)
  • Tokyo, JP (2004 - 2022)

Company Filing History:


Years Active: 1996-2025

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Areas of Expertise:
Copper Alloy Wire
Conductive Wire
Optical Communication
Semiconductor Memory
Aluminum Alloy Wire
Electrical Cable
Data Erasure
Integrated Circuit
Optical Amplification
Manufacturing Method
20 patents (USPTO):Explore Patents

Title: Takashi Hayasaka: A Pioneer in Copper Alloy Innovations

Introduction

Takashi Hayasaka, an esteemed inventor based in Tokyo, Japan, has made significant contributions to the field of materials science and electrical engineering, particularly through his innovative work with copper alloys. With a total of 19 patents to his name, Hayasaka's inventions focus on advancing the performance and manufacturing processes of conductive materials.

Latest Patents

Among his latest innovations is a patent for a copper alloy wire engineered specifically to enhance its mechanical and electrical properties. The copper alloy is composed of at least 0.3 mass % indium and ensures a proof stress of 300 MPa or more, an electrical conductivity of 80% IACS or greater, and an elongation of at least 7%. This unique composition not only boosts the efficacy of electrical applications but also adds durability to the components.

Moreover, Hayasaka has patented a method for manufacturing conductive wire that involves a continuous casting process. This method utilizes an alloy material with minimal added metals, achieving high efficiency by casting at rates between 40 mm/min and 200 mm/min. The process includes subsequent diameter reductions and heat treatments to optimize tensile strength, ultimately producing a conductive wire that meets stringent performance standards.

Career Highlights

In his professional journey, Takashi Hayasaka has worked with prominent companies such as Mitsubishi Electric Corporation and Hitachi Metals, Ltd. His expertise and dedication have led to groundbreaking advancements in the production and application of conductive materials, making him a valued asset in the engineering community.

Collaborations

Throughout his career, Hayasaka has collaborated with notable experts in the field, including Toshihiko Hirose and Shigeki Ohbayashi. These partnerships have fostered innovation and led to the development of several patented technologies that aim to improve efficiency and performance in electrical systems.

Conclusion

Takashi Hayasaka stands out as a key figure in the advancement of copper alloy wire and conductive materials. His 19 patents demonstrate a deep commitment to innovation, pushing the boundaries of what is possible in electrical engineering. As technology continues to evolve, the impact of his work will likely resonate within the industry for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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