The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Jan. 29, 2016
Hitachi Metals, Ltd., Tokyo, JP;
Keisuke Fujito, Mito, JP;
Takashi Hayasaka, Kitaibaraki, JP;
Takeshi Usami, Hitachi, JP;
Toru Sumi, Hitachi, JP;
HITACHI METALS, LTD., Tokyo, JP;
Abstract
An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.