The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Jan. 29, 2020
Hitachi Metals, Ltd., Tokyo, JP;
Seigi Aoyama, Tokyo, JP;
Toru Sumi, Tokyo, JP;
Takashi Hayasaka, Tokyo, JP;
Ryohei Okada, Tokyo, JP;
Detian Huang, Tokyo, JP;
Tamotsu Sakurai, Tokyo, JP;
Satoshi Yajima, Hitachi, JP;
Minoru Takatsuto, Hitachi, JP;
Hiroshi Bando, Hitachi, JP;
Proterial, Ltd., Tokyo, JP;
Abstract
A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.