The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Feb. 01, 2021
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Hiromitsu Kuroda, Tokyo, JP;
Takashi Hayasaka, Tokyo, JP;
Detian Huang, Tokyo, JP;
Ryohei Okada, Tokyo, JP;
Tamotsu Sakurai, Tokyo, JP;
Assignee:
Hitachi Metals, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/02 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01);
Abstract
A copper alloy wire is made of a copper alloy, and the copper alloy contains indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.45 mass %. A tensile strength of the copper alloy wire is equal to or higher than 800 MPa, and an electrical conductivity of the same is equal to or higher than 80% IACS.