The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Dec. 28, 2021
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Hiromitsu Kuroda, Tokyo, JP;
Takashi Hayasaka, Tokyo, JP;
Detian Huang, Tokyo, JP;
Ryohei Okada, Tokyo, JP;
Tamotsu Sakurai, Tokyo, JP;
Assignee:
PROTERIAL, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C22C 9/00 (2006.01); H01B 7/18 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); C22C 9/00 (2013.01); H01B 7/18 (2013.01);
Abstract
A copper alloy wire is composed of a copper alloy including indium of 0.3 mass % or more and 0.65 mass % or less, and has 0.2% proof stress of 300 MPa or more, electrical conductivity of 80% IACS or more, and elongation of 7% or more.