Tokyo, Japan

Takao Yamazaki

This inventor holds 25 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignees: Nec Corporation, Nec Access Technica, Ltd., Donaldson Comapny, Inc.. Active years: 1980-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takao Yamazaki. Retrieved from https://idiyas.com/inventor/takao-yamazaki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 64.0

Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 209(Granted Patents)


Location History:

  • Tokyo, JP (1980 - 2015)
  • Minato-ku, JP (2012 - 2015)

Company Filing History:


Years Active: 1980-2015

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Areas of Expertise:
Infrared Ray Sensor
Semiconductor Device
Electronic Device
3D Packaging
Encapsulating Package
Circuit Board
Optical Unit
Conductive Rubber
Decoupling Capacitors
Thin Film Capacitor
Vacuum Package
Mounting Structure
25 patents (USPTO):Explore Patents

Title: Takao Yamazaki: Innovator in Infrared Sensor Technology

Introduction

Takao Yamazaki is a prominent inventor based in Tokyo, Japan, known for his remarkable contributions to the field of infrared sensor technology. With a total of 25 patents to his name, Yamazaki has been instrumental in advancing the functionality of infrared sensors and related electronic devices, demonstrating his innovative spirit and technical expertise.

Latest Patents

Among his latest patents are groundbreaking inventions including an infrared ray sensor package and an infrared ray sensor module. These inventions focus on maintaining the gas adsorption capability of a getter while ensuring that the characteristics of the infrared ray sensor element remain intact. The infrared ray sensor package features a vacuum-sealed infrared ray sensor element contained within a base substrate, housing, and an infrared ray transmission window. Additionally, the incorporation of a spacer creates an optimal gap, while a heat shielding member and a getter are strategically placed to enhance performance. Another significant patent describes a method of manufacturing a three-dimensional packaging semiconductor device, which utilizes a flexible circuit board and incorporates various memory devices and passive components to optimize design and functionality.

Career Highlights

Takao Yamazaki has had a distinguished career, notably working with prestigious companies such as NEC Corporation and NEC Access Technica, Ltd. His roles in these organizations have enabled him to hone his skills and contribute to cutting-edge technological advancements.

Collaborations

Throughout his career, Yamazaki has had the pleasure of collaborating with notable colleagues, including Yoshimichi Sogawa and Yuzo Shimada. These partnerships have provided opportunities for shared knowledge and accelerated innovation in the projects they undertook.

Conclusion

Takao Yamazaki exemplifies the role of an innovative inventor with a keen focus on developing advanced technology in the realm of infrared sensors and semiconductor devices. His impressive portfolio of patents and collaborative spirit highlights his commitment to driving progress in technology, paving the way for future advancements in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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