Nec Corporation

Nec Access Technica, Ltd.

Nec Electronics Corporation

Donaldson Comapny, Inc.

Jsr Corporation

Nec Accesstechnia Ltd.

Takao Yamazaki

Yoshimichi Sogawa

Shinji Watanabe

Yuzo Shimada

Shintaro Yamamichi

Toru Mori

Akinobu Shibuya

Katsuhiko Suzuki

Sakae Kitajo

Ichiro Hazeyama

Seiji Kurashina

Shizuaki Masuda

Masahiro Kubo

Hidehiko Kuroda

Hirobumi Inoue

Masahiko Sano

Koji Kato

Nobuyuki Sato

Tomohiro Nishiyama

Yuji Akimoto

Naoji Senba

Ichiro Hatakeyama

Tokuhito Sasaki

Tomoo Murakami

Shigeru Moribayashi

Toshiaki Shironouchi

Yoshiaki Morishita

Kiyonori Kita

Minoru Tsuneyoshi

Masaaki Takashima

Yuuki Fujimura

Minoru Onuma

Masayoshi Nakamura

Tatsuo Ohta

Shinji Watababe

Ryoji Osu

Kikuo Wada

Kenji Ohyachi

Kowashi Taketomi

According to the present invention, the gas adsorption capability of a getter can be maintained while the characteristics of an infrared ray sensor element are prevented from being deteriorated. An infrared ray sensor package has an infrared ray sensor element, a base substrate, a housing, an infrared ray transmission window, and a getter. The infrared ray sensor element is vacuum-sealed in a space surrounded by the base substrate, the housing, and the infrared ray transmission window. A spacer is disposed between the infrared ray sensor element and the base substrate to form a gap between the infrared ray sensor element and the base substrate. The getter is arranged in the gap formed between the infrared ray sensor element and the base substrate. A heat shielding member is disposed between the infrared ray sensor element and the getter. The heat shielding member is a heater for heating the infrared ray sensor element or an element formed of alloy containing Ni or heat-resistant glass.

Infrared ray sensor package, infrared ray sensor module, and electronic device

Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a second face; a plurality of memory devices and passive components; a supporter which is provided with a groove on one face; and a computing processor device. The memory devices and the passive components are connected to the first external electrode, the one face of the supporter is bonded on the first face of the flexible circuit board so that the groove houses the memory devices and the passive components. The flexible circuit board is bent along a perimeter of the supporter to be wrapped around a side face and another face of the supporter. On the flexible circuit board, the second external electrode is provided on the second face which is opposite to the first external electrode, and the third external electrode is provided on the second face which is bent to the another face of the supporter. The computing processor device is connected to the second external electrode, and a bump is formed on the third external electrode.

Method of manufacturing a three-dimensional packaging semiconductor device

An infrared sensor package includes a housing member, which includes an upper-surface section provided with a transmission member which transmits infrared radiation and a lower-surface section and whose inner space is vacuum-sealed, a plate-like heater member which is disposed within the inner space of the housing member and generates heat, an infrared detection element which is fixed onto the heater member and detects the infrared radiation which is transmitted by the transmission member, and a heat-insulating member which has a low thermal conductivity and a smaller cross-sectional area than that of the heater member, and supports the heater member while being fixed onto the lower-surface section.

Infrared sensor package and electronic device equipped therewith

The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.

Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package

The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor packageincludes: a semiconductor deviceincluding a circuit face on which an external electrode is formed; an insertion substrateforming a housing part in which the semiconductor deviceis disposed; and an interposer substrateincluding a wiring patternand whose both ends are bent along the insertion substrate. The insertion substrateis made of a conductive material and is electrically connected to a ground line or a power supply line in the wiring patternin the interposer substrate

Electronic device package, module, and electronic device

Semiconductor device

There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package.

Semiconductor device and manufacturing method thereof

A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.

Mounting structure of semiconductor device and electronic apparatus using thereof

A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.

Device having electronic components mounted therein and method for manufacturing such device

A mounting structure includes: at least one semiconductor device having solder bumps as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is structured to be wrapped by the flexible wiring board, the mounting structure is provided with outer electrodes on both sides of the flexible wiring board, one side being a side where outer terminals of the semiconductor device are formed, and the other side being an opposite side thereof. At least one wiring layer is formed on the flexible wiring board. A supporting member is provided covering side faces and a surface of the semiconductor device opposite to the side where the outer terminals are formed and protruding from the side faces of the semiconductor device and extending toward the surface on which the outer terminals are formed.

Mounting structure of semiconductor device and electronic apparatus using same

There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package (FIG.).

There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrateincludes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film) is formed to increase strength of the wiring pattern.

Electronic package device, module, and electronic apparatus

A vacuum package has a chamber in which pressure is reduced to less than the atmospheric pressure, a functional component sealed in the chamber, and a material forming at least a part of the chamber. The material has at least one through hole to evacuate the chamber. In a cross section perpendicular to the material taken along the through hole, an edge portion of the material forming the through hole has an obtuse angle. The through hole is sealed with a sealing material.

Vacuum package and manufacturing process thereof

A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus

Growing community of inventors

Tokyo, Japan

Takao Yamazaki