The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Jan. 25, 2007
Takao Yamazaki, Tokyo, JP;
Yoshimichi Sogawa, Tokyo, JP;
Tomohiro Nishiyama, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor packageincludes: a semiconductor deviceincluding a circuit face on which an external electrode is formed; an insertion substrateforming a housing part in which the semiconductor deviceis disposed; and an interposer substrateincluding a wiring patternand whose both ends are bent along the insertion substrate. The insertion substrateis made of a conductive material and is electrically connected to a ground line or a power supply line in the wiring patternin the interposer substrate