The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Jul. 18, 2008
Takao Yamazaki, Minato-ku, JP;
Shinji Watanabe, Minato-ku, JP;
Tomoo Murakami, Minato-ku, JP;
Yuuki Fujimura, Minato-ku, JP;
Ryoji Osu, Kakegawa, JP;
Katsuhiko Suzuki, Kakegawa, JP;
Shizuaki Masuda, Kakegawa, JP;
Nobuyuki Sato, Kakegawa, JP;
Kikuo Wada, Kakegawa, JP;
Takao Yamazaki, Minato-ku, JP;
Shinji Watanabe, Minato-ku, JP;
Tomoo Murakami, Minato-ku, JP;
Yuuki Fujimura, Minato-ku, JP;
Ryoji Osu, Kakegawa, JP;
Katsuhiko Suzuki, Kakegawa, JP;
Shizuaki Masuda, Kakegawa, JP;
Nobuyuki Sato, Kakegawa, JP;
Kikuo Wada, Kakegawa, JP;
NEC Corporation, Tokyo, JP;
NEC Access Technica, Ltd., Kakegawa, JP;
Abstract
A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.