The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Nov. 07, 2005
Takao Yamazaki, Tokyo, JP;
Hirobumi Inoue, Tokyo, JP;
Ichiro Hazeyama, Tokyo, JP;
Sakae Kitajo, Tokyo, JP;
Masahiro Kubo, Tokyo, JP;
Yoshimichi Sogawa, Tokyo, JP;
Hidehiko Kuroda, Tokyo, JP;
Takao Yamazaki, Tokyo, JP;
Hirobumi Inoue, Tokyo, JP;
Ichiro Hazeyama, Tokyo, JP;
Sakae Kitajo, Tokyo, JP;
Masahiro Kubo, Tokyo, JP;
Yoshimichi Sogawa, Tokyo, JP;
Hidehiko Kuroda, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.