Company Filing History:

11 out of 35,705

Nec Corporation

Nitto-denko Corporation

5. 1 out of 832,843

Other

patents

where one patent can have more than one assignee

Years Active: 1998-2021

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10896827 - Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages (2021-01-19),

2. 7594644 - Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus (2009-09-29),

3. 7352069 - Electronic component unit (2008-04-01),

4. 7230328 - Semiconductor package and laminated semiconductor package (2007-06-12),

5. 7119438 - Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device (2006-10-10),

6. 6998704 - Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus (2006-02-14),

7. 6926188 - Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip (2005-08-09),

8. 6889886 - Transfer apparatus for arraying small conductive bumps on substrate and/ or chip (2005-05-10),

9. 6674016 - Electronic component (2004-01-06),

10. 6348424 - Low-temperature calcined glass ceramic and a manufacturing process therefor (2002-02-19),

11. 5902758 - Low temperature firing glass-ceramic substrate and production process (1999-05-11),

12. 5728470 - Multi-layer wiring substrate, and process for producing the same (1998-03-17),

13. 5714112 - Process for producing a silica sintered product for a multi-layer wiring (1998-02-03),

Title: Ichiro Hazeyama: Innovator in Semiconductor Manufacturing

Introduction

Ichiro Hazeyama is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 13 patents. His work focuses on enhancing the durability and efficiency of semiconductor packages, which are crucial components in modern electronic devices.

Latest Patents

Hazeyama's latest patents include innovative methods and supports for manufacturing semiconductor packages. One of his notable inventions is a support designed to provide excellent durability during various treatments such as polishing, heating, exposing/developing, plating, and vacuuming. This support consists of a substrate layer and an adhesive layer, with the substrate layer made from an alicyclic structure-containing resin film. Additionally, he has developed a semiconductor device that includes a flexible substrate and a method for manufacturing the same, which enhances the connection between semiconductor elements and electrode pads.

Career Highlights

Throughout his career, Ichiro Hazeyama has worked with notable companies, including NEC Corporation and Japan E.M. Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Hazeyama has collaborated with several talented individuals in the field, including Sakae Kitajo and Masahiro Kubo. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Ichiro Hazeyama's contributions to semiconductor manufacturing have established him as a key figure in the industry. His innovative patents and collaborations continue to influence the advancement of technology in electronics.

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