The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Jan. 10, 2003
Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device
Ichiro Hazeyama, Tokyo, JP;
Masahiro Kubo, Tokyo, JP;
Sakae Kitajo, Tokyo, JP;
Kazuhiko Futakami, Hamamatsu, JP;
Shinichi Ishiduka, Hamamatsu, JP;
Susumu Nanko, Hamamatsu, JP;
Hitoshi Anma, Hamamatsu, JP;
Tosiji Yamada, Hamamatsu, JP;
Akeo Katahira, Hamamatsu, JP;
Ichiro Hazeyama, Tokyo, JP;
Masahiro Kubo, Tokyo, JP;
Sakae Kitajo, Tokyo, JP;
Kazuhiko Futakami, Hamamatsu, JP;
Shinichi Ishiduka, Hamamatsu, JP;
Susumu Nanko, Hamamatsu, JP;
Hitoshi Anma, Hamamatsu, JP;
Tosiji Yamada, Hamamatsu, JP;
Akeo Katahira, Hamamatsu, JP;
NEC Corporation, , JP;
Japan E M Co., Ltd., , JP;
Abstract
A method of arranging microspheres with liquid, a microsphere arranging device, and a semiconductor device are provided. The method comprising the steps of placing the semiconductor device with a large number of pads with holes, on a loading table with a variable tilt angle, and pouring microspheres together with conductive liquid held in a holding container onto the semiconductor device. The microspheres are storably placed in the holes on the pads of the semiconductor device. The non-stored microspheres and conductive liquid are accumulated in a receiving tank, and the conductive liquid including the accumulated microspheres are transferred to the holding container by a pump.