The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2021
Filed:
Jun. 19, 2017
Applicant:
Zeon Corporation, Tokyo, JP;
Inventor:
Ichiro Hazeyama, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); C09J 201/00 (2006.01); H01L 21/52 (2006.01); C09J 7/24 (2018.01); C09J 7/25 (2018.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); C09J 7/241 (2018.01); C09J 7/25 (2018.01); C09J 201/00 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); C09J 2203/326 (2013.01); H01L 21/561 (2013.01); H01L 2224/97 (2013.01);
Abstract
To provide a support for manufacturing semiconductor packages which has excellent durability in treatments such as polishing, heating, exposing/developing, plating, and vacuuming; a use of the support for manufacturing semiconductor packages; and a method of manufacturing semiconductor packages. The support includes a substrate layer and an adhesive layer adjacent to the substrate layer, wherein the substrate layer is formed of an alicyclic structure-containing resin film.