The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Nov. 04, 2003
Ichiro Hazeyama, Tokyo, JP;
Sakae Kitajo, Tokyo, JP;
Yuzo Shimada, Tokyo, JP;
Akeo Katahira, Shizuoka, JP;
Jun Ishida, Shizuoka, JP;
Masaru Terashima, Shizuoka, JP;
Kazuhiko Futakami, Shizuoka, JP;
Ichiro Hazeyama, Tokyo, JP;
Sakae Kitajo, Tokyo, JP;
Yuzo Shimada, Tokyo, JP;
Akeo Katahira, Shizuoka, JP;
Jun Ishida, Shizuoka, JP;
Masaru Terashima, Shizuoka, JP;
Kazuhiko Futakami, Shizuoka, JP;
NEC Corporation, Tokyo, JP;
Japan E.M. Co., Ltd., Shizuoka, JP;
Abstract
Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.