The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Dec. 24, 2003
Ichiro Hazeyama, Minato-ku, JP;
Masahiro Kubo, Minato-ku, JP;
Sakae Kitajo, Minato-ku, JP;
Koji Matsui, Minato-ku, JP;
Kazumasa Igarashi, Ibaraki, JP;
Hiroshi Noro, Ibaraki, JP;
Ichiro Hazeyama, Minato-ku, JP;
Masahiro Kubo, Minato-ku, JP;
Sakae Kitajo, Minato-ku, JP;
Koji Matsui, Minato-ku, JP;
Kazumasa Igarashi, Ibaraki, JP;
Hiroshi Noro, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
NEC Corporation, Tokyo, JP;
Abstract
An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) () is mounted on a wiring circuit substrate () under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) () and a circuit electrode () disposed on the wiring circuit substrate () are facing with each other. In addition, the gap between the wiring circuit substrate () and the semiconductor element (flip chip) () is filled by a filling resin layer () comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C).