The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2010
Filed:
Feb. 28, 2007
Takao Yamazaki, Tokyo, JP;
Yoshimichi Sogawa, Tokyo, JP;
Toshiaki Shironouchi, Kanagawa, JP;
Kenji Ohyachi, Kanagawa, JP;
Takao Yamazaki, Tokyo, JP;
Yoshimichi Sogawa, Tokyo, JP;
Toshiaki Shironouchi, Kanagawa, JP;
Kenji Ohyachi, Kanagawa, JP;
NEC Corporation, Tokyo, JP;
Abstract
There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrateincludes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film) is formed to increase strength of the wiring pattern.