This inventor holds 1 USPTO granted patent. Top assignee: Nec Corporation. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Kenji Ohyachi: Innovator in Electronic Packaging Technology
Introduction
Kenji Ohyachi is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of electronic packaging, particularly with his innovative designs that enhance the durability and functionality of electronic devices.
Latest Patents
Ohyachi holds a patent for an electronic package device, module, and electronic apparatus. This invention addresses the issue of potential damage to wiring patterns in interposer substrates, especially in the gap section formed between an electronic device and an insertion substrate. The semiconductor package he developed is a fan-out type that includes an interposer substrate, a semiconductor device, and an insertion substrate. A key feature of this design is the inclusion of a reinforcing member, such as a metallic film, which increases the strength of the wiring pattern in areas corresponding to the gap.
Career Highlights
Kenji Ohyachi is associated with NEC Corporation, where he has been instrumental in advancing electronic packaging technologies. His work has not only contributed to the company's portfolio but has also set new standards in the industry.
Collaborations
Ohyachi has collaborated with notable colleagues, including Takao Yamazaki and Yoshimichi Sogawa. Their combined expertise has fostered innovation and development in electronic packaging solutions.
Conclusion
Kenji Ohyachi's contributions to electronic packaging technology exemplify the importance of innovation in enhancing device reliability and performance. His patent reflects a commitment to improving the durability of electronic devices, making him a significant figure in the field.