Tokyo, Japan

Takahiro Yokoyama

This inventor holds 30 USPTO granted patents and 11 published patent applications, plus 2 CIPO patents and 6 EPO patents, primarily in Semiconductor Technology. Top assignees: Renesas Technology Corp., Daikin Industries, Ltd., Hitachi, Ltd.. Active years: 1999-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiro Yokoyama. Retrieved from https://idiyas.com/inventor/takahiro-yokoyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 86.7

 

 

Average Co-Inventor Count = 2.7

ph-index = 6

Forward Citations = 102(Granted Patents)


Location History:

  • Hyogo, JP (1999 - 2012)
  • Yokohama, JP (2013)
  • Saitama, JP (2022)
  • Tokyo, JP (2004 - 2024)
  • Osaka, JP (2021 - 2024)

Company Filing History:


Years Active: 1999-2026

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Areas of Expertise:
Solder Alloy
Solder Paste
Hydropower Generation
Motor Drive
Semiconductor Device
Cooling Apparatus
High-Frequency Amplifier
RF-Driven Device
Data Processing
Compound Semiconductor
30 patents (USPTO):Explore Patents

Title: Innovations by Takahiro Yokoyama: A Pioneer in Solder Alloys

Introduction

Takahiro Yokoyama, based in Tokyo, Japan, is a distinguished inventor boasting an impressive portfolio of 22 patents. His innovative contributions, primarily in the field of solder alloys and solder joints, have significantly advanced technology in electronic manufacturing.

Latest Patents

Yokoyama's latest patents include remarkable advancements in solder alloy and solder joint technologies. One of his innovations outlines a solder alloy and joint designed to minimize solder bridges and icicles while reducing dross production in solder tanks. The alloy composition, which consists of copper (more than 2.0% and less than 3.0%), nickel (0.010% or more and less than 0.30%), and germanium (0.0010% to 0.20%), balances strength with optimal functionality.

Additionally, he has developed a solder alloy, solder paste, solder ball, and resin flux-cored solder featuring a low melting point that enhances ductility and shear strength while improving heat-cycle resistance. This composition includes 35 to 68 mass % of bismuth, along with antimony, nickel, and tin, which enables exceptional performance under various conditions.

Career Highlights

Throughout his career, Takahiro Yokoyama has made substantial contributions to the field of technology. He has worked for prominent companies, including Renesas Technology Corporation and Matsushita Electric Industrial Co., Ltd., where he applied his expertise to develop innovative solder materials and solutions. His work has propelled advancements in electronic component manufacturing, ensuring enhanced reliability and performance.

Collaborations

Yokoyama's journey in innovation has seen him collaborate with notable individuals in the industry, such as Shunsaku Yoshikawa and Masamichi Fujito. These partnerships have fostered a creative exchange of ideas and expertise, pushing the boundaries of what is possible in solder technology.

Conclusion

Takahiro Yokoyama stands as a leading figure in the field of solder alloys, exemplifying the spirit of innovation through his patents and collaborations. His work continues to influence the electronics industry and serves as a foundational pillar for future advancements in solder technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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